Photolithography · Mask Aligner
Photolithography with EVG® 620 Mask Aligner
Walks learners through the full lithography workflow: dehydration bake, adhesion promotion, photoresist
coating, soft bake, exposure and development.
- Operate oven, spin coater, hot plates and EVG 620 mask aligner.
- Practice mask loading, UV exposure and DI water rinsing.
- Connect each step to its role in chip fabrication.
Plasma · Reactive Ion Etching
Reactive Ion Etching (RIE) Module
Simulates the MARCH CS-1701 system for plasma-based pattern transfer into thin films.
- Turn on chiller, RF generator and RIE chamber safely.
- Configure gas lines and recipe parameters using VR widgets.
- Load/unload wafers and observe etch completion feedback.
Thermal · Rapid Thermal Annealing
Rapid Thermal Annealing (Heatpulse 410)
Models the Heatpulse 410 Rapid Thermal Processor for dopant activation and thin-film treatment.
- Follow cooling water and nitrogen purging steps.
- Set temperature/time profiles via interactive controls.
- Monitor wafer loading, processing and completion.
Metrology · Deposition
Sheet Resistivity & E-Beam Evaporation
Two complementary modules: one for four-point probe resistivity measurements, and one for thin-film
deposition using e-beam evaporation.
- Operate current source and DMM to log voltage and compute resistivity.
- Simulate vacuum pump-down, deposition and venting steps for an e-beam tool.
- Connect measured electrical properties back to process settings.